Journal article
Rahul Kumar, Somesh Kumar, Surila Guglani, Sourajeet Roy, Brajesh Kumar Kaushik, Rohit Sharma, R. Achar
Workshop on Signal Propagation on Interconnects, 2020
Workshop on Signal Propagation on Interconnects, 2020
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DOI
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APA
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Kumar, R., Kumar, S., Guglani, S., Roy, S., Kaushik, B. K., Sharma, R., & Achar, R. (2020). Temperature-Aware Compact Modeling for Resistivity in Ultra-Scaled Cu-Graphene Hybrid Interconnects. Workshop on Signal Propagation on Interconnects.
Chicago/Turabian
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Kumar, Rahul, Somesh Kumar, Surila Guglani, Sourajeet Roy, Brajesh Kumar Kaushik, Rohit Sharma, and R. Achar. “Temperature-Aware Compact Modeling for Resistivity in Ultra-Scaled Cu-Graphene Hybrid Interconnects.” Workshop on Signal Propagation on Interconnects (2020).
MLA
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Kumar, Rahul, et al. “Temperature-Aware Compact Modeling for Resistivity in Ultra-Scaled Cu-Graphene Hybrid Interconnects.” Workshop on Signal Propagation on Interconnects, 2020.
BibTeX Click to copy
@article{rahul2020a,
title = {Temperature-Aware Compact Modeling for Resistivity in Ultra-Scaled Cu-Graphene Hybrid Interconnects},
year = {2020},
journal = {Workshop on Signal Propagation on Interconnects},
author = {Kumar, Rahul and Kumar, Somesh and Guglani, Surila and Roy, Sourajeet and Kaushik, Brajesh Kumar and Sharma, Rohit and Achar, R.}
}
Abstract
Due to highly-scaled feature sizes of on-chip interconnects at advanced technology nodes, size effects dominate the conductor losses. Also, the surface roughness effects in Cu interconnects increase due to scaling. Graphene has been recently proposed as a barrier layer in Cu interconnects to mitigate these conductor losses. This paper reports a temperature-dependent compact model for resistivity and resistance of hybrid interconnects, where each conductor consists of a Cu interconnects with a Graphene barrier layer on all sides. For the 7 nm technology node, our analysis shows that hybrid interconnects has 25%, 91%, and 36% lesser resistivity as compared to smooth, rough, and GNR interconnects, respectively. We also present signal integrity analysis for performance benchmarking of hybrid interconnects against conventional Cu interconnects. For 200 Mbps data rate, eye height and eye width for hybrid interconnects improve by 47% and 8x as compared to that in smooth Cu interconnects.