CMAS Lab

Indian Institute of Technology Roorkee

Efficient multidimensional statistical modeling of high speed interconnects in SPICE via stochastic collocation using stroud cubature


Journal article


Majid Ahadi, Mounica Vempa, Sourajeet Roy
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, 2015

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APA   Click to copy
Ahadi, M., Vempa, M., & Roy, S. (2015). Efficient multidimensional statistical modeling of high speed interconnects in SPICE via stochastic collocation using stroud cubature. 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.


Chicago/Turabian   Click to copy
Ahadi, Majid, Mounica Vempa, and Sourajeet Roy. “Efficient Multidimensional Statistical Modeling of High Speed Interconnects in SPICE via Stochastic Collocation Using Stroud Cubature.” 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (2015).


MLA   Click to copy
Ahadi, Majid, et al. “Efficient Multidimensional Statistical Modeling of High Speed Interconnects in SPICE via Stochastic Collocation Using Stroud Cubature.” 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, 2015.


BibTeX   Click to copy

@article{majid2015a,
  title = {Efficient multidimensional statistical modeling of high speed interconnects in SPICE via stochastic collocation using stroud cubature},
  year = {2015},
  journal = {2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity},
  author = {Ahadi, Majid and Vempa, Mounica and Roy, Sourajeet}
}


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